SCIE
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 期刊简介
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
英文简介:

The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.

中文简介:(来自Google、百度翻译)

该出版物的范围包括但不限于: 器件、材料、工艺、接口、集成微系统 (包括MEMS和传感器) 、晶体管、技术 (CMOS、BiCMOS等) 、集成电路 (IC、SSI、MSI、LSI、ULSI、ELSI、等),薄膜晶体管应用。从概念阶段到研发,再到制造规模扩大,在每个阶段对此类实体的可靠性进行测量和理解,提供了有关设备,材料,工艺,包装和其他必需品的可靠性的总体数据库。成功地将产品推向市场。该可靠性数据库是满足客户期望的优质产品的基础。如此开发的产品具有很高的可靠性。将实现高质量,因为将发现产品弱点 (根本原因分析) 并从最终产品中设计出来。这种不断提高可靠性和质量的过程将产生卓越的产品。最后,可靠性和质量不是一回事; 但从某种意义上说,一切都可以或必须这样做,以确保产品在客户条件下在现场成功运行。我们的目标是抓住这些进步。另一个目标是将交叉施肥通信集中在电子材料和设备的可靠性领域中,并提供对影响可靠性的基本现象的基本了解。此外,该出版物是可靠性跨学科研究的论坛。总体目标是提供前沿/最新信息,这与创建可靠的产品至关重要。

期刊ISSN
1530-4388
影响指数
1.743
最新CiteScore值
3.50 查看CiteScore评价数据
最新自引率
6.60%
期刊官方网址
http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=7298
期刊投稿网址
http://mc.manuscriptcentral.com/tdmr
通讯地址
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
偏重的研究方向(学科)
工程技术-工程:电子与电气
出版周期
Quarterly
出版年份
0
出版国家/地区
UNITED STATES
是否OA
No
SCI期刊coverage
Science Citation Index Expanded(科学引文索引扩展)
NCBI查询
PubMed Central (PMC)链接 全文检索(pubmed central)
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 期刊中科院JCR 评价数据
最新中科院JCR分区
大类(学科)
小类(学科)
综述期刊
工程技术
ENGINEERING, ELECTRICAL & ELECTRONIC(工程:电子与电气)4区 PHYSICS, APPLIED(物理:应用)4区
最新的影响因子
1.743
最新公布的期刊年发文量
年度总发文量 研究类文章占比
92 100.00%
总被引频次 63
影响因子趋势图
近年的影响因子趋势图(整体平稳趋势)
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 期刊CiteScore评价数据
最新CiteScore值
3.50
年文章数 92
SJR
0.384
SNIP
1.134
CiteScore排名
序号 类别(学科) 排名 百分位
1 Engineering Safety, Risk, Reliability and Quality #56/165
2 Engineering Electrical and Electronic Engineering #271/693
3 Engineering Electronic, Optical and Magnetic Materials #110/246
CiteScore趋势图
CiteScore趋势图
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 投稿经验(由下方点评分析获得,3人参与,1239人阅读)
投稿录用比例: 较易
审稿速度: 较慢,6-12周
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