MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 期刊简介

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
英文简介:

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

中文简介:(来自Google、百度翻译)

半导体加工中的材料科学为讨论 (光电) 电子,传感器,探测器,生物技术和绿色能源的功能材料和器件的新颖加工,应用和理论研究提供了一个独特的论坛。
每个问题都旨在提供当前见解的快照,在微电子,能量转换和存储,通信,生物技术,(照片) 催化,纳米和薄膜技术,混合和复合材料,化学加工,气相沉积,器件制造等各个领域的新成就,突破和未来趋势,它们是先进半导体加工和应用的支柱。
覆盖范围将包括: 亚微米器件的先进光刻; 蚀刻和相关主题; 离子注入; 损伤演变和相关问题; 等离子体和热CVD; 快速热处理; 先进的金属化和互连方案; 薄介电层,氧化; 溶胶-凝胶加工; 化学浴和 (电) 化学沉积; 化合物半导体加工; 新型非氧化物材料及其应用; (宏观) 分子和杂化材料; 分子动力学、从头算方法、蒙特卡罗等; 分立和集成电路的新材料和工艺; 磁性材料和自旋电子学; 异质结构和量子器件; 半导体电学和光学性质的工程; 晶体生长机制; 可靠性、缺陷密度、固有杂质和缺陷。

期刊ISSN
1369-8001
影响指数
3.888
最新CiteScore值
5.90 查看CiteScore评价数据
最新自引率
5.80%
官方指定润色网址
https://www.deeredit.com/?type=ss1
投稿语言要求

Improve the quality of the paper, eliminate grammar and spelling errors, increase readability, ensure accurate communication of viewpoints, enhance academic reputation, and increase the chances of the paper being accepted.

建议点击这个网址:https://www.deeredit.com/?type=ss2,资深审稿专家为您评估稿件质量,提供针对性改进建议,最终可助您极大提升目标期刊录用率

期刊官方网址

hot

https://www.peipusci.com/?type=9
杂志社征稿网址

hot

https://www.peipusci.com/?type=10
通讯地址
ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
偏重的研究方向(学科)
工程技术-材料科学:综合
出版周期
Bimonthly
出版年份
0
出版国家/地区
ENGLAND
是否OA
No
SCI期刊coverage
Science Citation Index Expanded(科学引文索引扩展)
NCBI查询
PubMed Central (PMC)链接 全文检索(pubmed central)
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 期刊中科院JCR 评价数据
最新中科院JCR分区
大类(学科)
小类(学科)
综述期刊
工程技术
ENGINEERING, ELECTRICAL & ELECTRONIC(工程:电子与电气)3区 MATERIALS SCIENCE, MULTIDISCIPLINARY(材料科学:综合)3区 PHYSICS, APPLIED(物理:应用)3区 PHYSICS, CONDENSED MATTER(物理:凝聚态物理)3区
最新的影响因子
3.888
最新公布的期刊年发文量
年度总发文量 研究类文章占比
485 98.35%
总被引频次 49
影响因子趋势图
近年的影响因子趋势图(整体平稳趋势)

2022年预警名单预测最新

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 期刊CiteScore评价数据
最新CiteScore值
5.90
年文章数 485
SJR
0.695
SNIP
1.098
CiteScore排名
序号 类别(学科) 排名 百分位
1 Engineering Mechanical Engineering #87/596
2 Engineering Mechanics of Materials #61/377
3 Engineering Condensed Matter Physics #72/411
4 Engineering Materials Science (all) #98/455
CiteScore趋势图
CiteScore趋势图
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING 投稿经验(由下方点评分析获得,10人参与,3044人阅读)
投稿录用比例: 约88.33%
审稿速度: 约1.7个月
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