IEEE Transactions on Components Packaging and Manufacturing Technology 期刊简介

IEEE Transactions on Components Packaging and Manufacturing Technology
英文简介:

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

中文简介:(来自Google、百度翻译)

IEEE组件,封装和制造技术学报发布了有关建模,设计,构建块,技术基础设施和分析的研究和应用文章,这些文章支持电子,光子和MEMS封装,此外还有无源组件,电触点和连接器的新发展,热管理和设备可靠性; 以及电子零件和组件的制造,广泛涵盖设计,工厂建模,组装方法,质量,产品坚固性和环境设计。

期刊ISSN
2156-3950
影响指数
1.721
最新CiteScore值
4.00 查看CiteScore评价数据
最新自引率
15.40%
官方指定润色网址
https://www.deeredit.com/?type=ss1
投稿语言要求

Improve the quality of the paper, eliminate grammar and spelling errors, increase readability, ensure accurate communication of viewpoints, enhance academic reputation, and increase the chances of the paper being accepted.

建议点击这个网址:https://www.deeredit.com/?type=ss2,资深审稿专家为您评估稿件质量,提供针对性改进建议,最终可助您极大提升目标期刊录用率

期刊官方网址

hot

https://www.peipusci.com/?type=9
杂志社征稿网址

hot

https://www.peipusci.com/?type=10
通讯地址
445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
偏重的研究方向(学科)
ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL
出版周期
出版年份
2011
出版国家/地区
UNITED STATES
是否OA
No
SCI期刊coverage
Science Citation Index Expanded(科学引文索引扩展)
NCBI查询
PubMed Central (PMC)链接 全文检索(pubmed central)
IEEE Transactions on Components Packaging and Manufacturing Technology 期刊中科院JCR 评价数据
最新中科院JCR分区
大类(学科)
小类(学科)
综述期刊
工程技术
ENGINEERING, ELECTRICAL & ELECTRONIC(工程:电子与电气)4区 ENGINEERING, MANUFACTURING(工程:制造)4区 MATERIALS SCIENCE, MULTIDISCIPLINARY(材料科学:综合)4区
最新的影响因子
1.721
最新公布的期刊年发文量
年度总发文量 研究类文章占比
233 99.14%
总被引频次 39
影响因子趋势图
近年的影响因子趋势图(整体平稳趋势)

2022年预警名单预测最新

IEEE Transactions on Components Packaging and Manufacturing Technology 期刊CiteScore评价数据
最新CiteScore值
4.00
年文章数 233
SJR
0.496
SNIP
1.062
CiteScore排名
序号 类别(学科) 排名 百分位
1 Engineering Industrial and Manufacturing Engineering #89/336
2 Engineering Electrical and Electronic Engineering #227/693
3 Engineering Electronic, Optical and Magnetic Materials #87/246
CiteScore趋势图
CiteScore趋势图
IEEE Transactions on Components Packaging and Manufacturing Technology 投稿经验(由下方点评分析获得,6人参与,1886人阅读)
投稿录用比例: 容易
审稿速度: 一般,3-6周
分享者 点评内容
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