MICROELECTRONICS INTERNATIONAL 期刊简介
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.
微电子国际提供了一个权威，国际和独立的论坛，用于评估和传播与高级封装，微电路工程，互连，半导体技术和系统工程有关的研发，应用，过程和当前实践。它代表了一种最新、全面和实用的信息工具。编辑John Atkinson博士欢迎对该期刊的贡献，包括技术论文，研究论文，案例研究和评论论文以供发表。有关更多详细信息，请查看作者指南。
Microelectronics International对与微型电子设备和高级封装的设计，制造，组装和各种应用相关的关键技术和相关问题进行了多学科研究。涵盖的广泛主题包括:
• 高级封装
• 陶瓷
• 芯片附件
• 板上芯片 (COB)
• 芯片级封装
• 柔性基板
• MEMS
• 微电路技术
• 微电子材料
• 多芯片模块 (MCMs)
• 有机/聚合物电子
• 印刷电子
• 半导体技术
• 固态传感器
• 热管理
• 厚/薄膜技术
• 晶圆级处理。
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期刊ISSN
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1356-5362 |
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影响指数
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0.75 |
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最新CiteScore值
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1.60 查看CiteScore评价数据 |
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最新自引率
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6.30% |
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官方指定润色网址
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https://www.deeredit.com/?type=ss1 |
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投稿语言要求
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Improve the quality of the paper, eliminate grammar and spelling errors, increase readability, ensure accurate communication of viewpoints, enhance academic reputation, and increase the chances of the paper being accepted. 建议点击这个网址：https://www.deeredit.com/?type=ss2，资深审稿专家为您评估稿件质量，提供针对性改进建议，最终可助您极大提升目标期刊录用率 |
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期刊官方网址
hot |
https://www.peipusci.com/?type=9 |
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杂志社征稿网址
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https://www.peipusci.com/?type=10 |
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通讯地址
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EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA |
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偏重的研究方向（学科）
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工程技术-材料科学：综合 |
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出版周期
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Tri-annual |
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出版年份
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0 |
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出版国家/地区
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ENGLAND |
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是否OA
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No |
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SCI期刊coverage
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Science Citation Index Expanded（科学引文索引扩展） |
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NCBI查询
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PubMed Central (PMC)链接 全文检索(pubmed central) |
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最新中科院JCR分区
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大类(学科)
小类(学科)
综述期刊
工程技术
ENGINEERING, ELECTRICAL & ELECTRONIC(工程：电子与电气)4区
MATERIALS SCIENCE, MULTIDISCIPLINARY(材料科学：综合)4区
否
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最新的影响因子
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0.75 | |||||
| 最新公布的期刊年发文量 |
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| 总被引频次 | 19 | |||||
| 影响因子趋势图 |
近年的影响因子趋势图（整体平稳趋势）
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2022年预警名单预测最新
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最新CiteScore值
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1.60
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| 年文章数 | 22 | ||||||||||||||||||||||||||
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SJR
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0.199 | ||||||||||||||||||||||||||
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SNIP
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0.365 | ||||||||||||||||||||||||||
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CiteScore排名
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| CiteScore趋势图 |
CiteScore趋势图
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本刊同领域相关期刊
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| 期刊名称 | IF值 |
| LANGMUIR | 3.843 |
| Science and Technology of Energetic Materials | 0.33 |
| GEOSYNTHETICS INTERNATIONAL | 3.626 |
| SENSORS AND MATERIALS | 0.751 |
| Smart Materials and Structures | 3.549 |
| Carbon Letters | 1.898 |
| Materials Horizons | 13.133 |
| Advanced Materials Interfaces | 6.086 |
| Journal of Materials Education | 0.584 |
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本刊同分区等级的相关期刊
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| 期刊名称 | IF值 |
| Science and Technology of Energetic Materials | 0.33 |
| SENSORS AND MATERIALS | 0.751 |
| Carbon Letters | 1.898 |
| Journal of Materials Education | 0.584 |
| MACHINING SCIENCE AND TECHNOLOGY | 2.232 |
| Advances in Production Engineering & Management | 3.348 |
| KONA Powder and Particle Journal | 2.868 |
| JOURNAL OF MICROWAVE POWER AND ELECTROMAGNETIC ENERGY | 1.312 |
| FIRE SAFETY JOURNAL | 2.736 |
| 分享者 | 点评内容 |
