Biomechanical effect of bone resorption of the spinous process after single-segment interspinous dynamic stabilization device implantation: A finite element analysis.

Abstract:

:This study aims to explore the influence of bone resorption of the spinous process after single-segment interspinous process device (IPD) implantation on the biomechanics of the lumbar spine.The 3D finite element model of the lumbar spine (L3-L5) was modified, and 2 models that simulated the presence and absence of bone resorption of the spinous process were developed using an IPD (Wallis). Its biomechanical effects, such as change in range of motion (ROM) and intervertebral disc and facet stress, were introduced at operative (L4/5) and adjacent (L3/4) levels.Compared with the INT model, the Wallis model and Wallis-BR model had similar ROMs in lateral flexion and rotation. However, the Wallis model had a lower L3-5 ROM in flexion (20.4% lower) and extension (26.4% lower), and L4-L5 ROM in flexion (74.1% lower) and extension (70.8% lower), while the overall ROM of the Wallis-BR model was greater than that of the Wallis model. The stress on the L3/L4 intervertebral disc and facets was similar for all 3 models. Compared with the INT model and Wallis-BR model, the stress on the L4/L5 intervertebral disc and facets under all movements significantly decreased in the Wallis model. The stress on the L5 process was greater than that on the L4 process in both the Wallis model and Wallis-BR model, and the load on the processes that underwent bone resorption was lower than that of the Wallis model.The function of the IPD slowly decreased with the occurrence of bone resorption of the interspinous process. This bone remodeling may be associated with high stress after IPD implantation.

journal_name

Medicine (Baltimore)

journal_title

Medicine

authors

Zhu ZQ,Duan S,Wang KF,Liu HY,Xu S,Liu CJ

doi

10.1097/MD.0000000000011140

subject

Has Abstract

pub_date

2018-07-01 00:00:00

pages

e11140

issue

27

eissn

0025-7974

issn

1536-5964

pii

00005792-201807060-00007

journal_volume

97

pub_type

杂志文章

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